By Charles Pfeil
This publication is for PCB designers who're designing forums with a number of very huge Ball Grid Array (BGA) programs. It explores the impression of dense BGAs with excessive pin-count on PCB layout and offers recommendations for the inherent layout demanding situations. even though you'll now not but were faced with the problems of routing BGAs and the effect on fabrication charges and sign integrity, this publication will demonstrate those capability pitfalls in addition to easy methods to mitigate those difficulties
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Additional info for BGA Breakouts and Routing: Effective Design Methods for Very Large BGAs
Layer Count The number of buildup and core layers required to route the board and fulfill the performance and signal integrity requirements will vary depending on the route density and manner in which you decide to manage the plane layer assignments. Determining the route density is a subject outside the scope of this book; however, as a general rule for large dense boards start with 8-10 signal layers and increase them as needed during the routing process. 42 Chapter Three – HDI Stackups Since the thickness of the laminated core will be limited by the aspect ratio of the buried via (10:1), work with your board fabricator to determine core and prepreg thicknesses.
Within 5 years, use of this kind of package will be common. 24 PRINTED CIRCUIT BOARD DESIGN Design for Manufacture -- Design Anywhere, Build Anywhere Accelerating development from concept to delivery is the key to profitability for today’s electronic products. Fundamental to achieving this acceleration is effective information flow within and between organizations. Collaboration, supported by Mentor's visECAD solution, enables the effective communication required to eliminate costly design defects and re-spins and maximize your company's profits.
Org IPC/JPCA-2315 Design Guide for High Density Interconnects and Micro-vias IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and Microvia Materials 31 BGA Breakouts and Routing HDI Type I This construction uses both micro-vias and through-vias in a structure consisting of a laminated core and a single micro-via layer on at least one side. Figure 3-1: IPC HDI Type I Notes • The number of layers in the laminated core varies and is limited by two factors o The through-via should have an aspect ratio (total length to hole diameter) less than 10x to maintain reasonable reliability.